We already told you about the so-called “chiplet” — thin silicon plates, in some way reinterpreted the concept of the traditional chips. Developed by engineers at Palo Alto Research Center (a division of Xerox) chipley can be tens and hundreds applied with a special printer on a flat surface. Apparently, the American military Agency DARPA are seriously interested in this technology. The new project involves the creation of modular computers based on different sets of chipsetov.
DARPA sees future of capleton as follows: if you need a system for fast processing of images – just collect it from the appropriate chipsetov. Need motherboard for satellite – just change some chipley other – and you’re done. On the official website of the military the Agency was issued a PDF document detailing the project. However, this is still at a very early stage of readiness, so the engineers brag there is nothing.
It’s unclear what size and what shape will chipley. It all depends on the professionals that will help DARPA to bring their vision to life, and to engage in the project will be a third-party company with direct financing from the military budget. It may well be that in the end components will be quite large and they can be changed by the owner after replacement of RAM modules. But it may be that chipley can be changed only at the factory with special equipment.
In any case, this system is much more flexible than the one to which we are accustomed. As a result, the electronics should be significantly reduced in size, become more focused on assigned tasks, as well as cheaper to manufacture. Given that many military computer systems today are hopelessly outdated, the introduction of a completely new system will upgrade your Arsenal of electronics and catch up with existing technology.
DARPA will build modular computers based on the “cabletow”
Sergey Grey