As a rule, if you need to join two metal parts, or you welded them to each other, or resort to the help of soldering iron. All depends on how large these details. Both of the above-mentioned process involve the use of high temperatures, resulting in risk of damage of parts or even explosion, when it comes to any threat production. Scientists from Boston’s northeastern University has developed a special glue that is able in some cases to make a full replacement of the welding machine and soldering iron.
The glue is called MesoGlue and it can bond two metal surfaces together or with other materials, and the process is carried out at room temperature. A team of researchers, led by Professor Hanchen Juan, have managed to create an adhesive consisting of microscopic nanorods based on the metal core. Some rods are coated with indium (atomic number 49) and the other – gallium (atomic number 31). In fact, we find two substances, which are applied to two surfaces: one the glue is applied with indium, and the second one with gallium.
After contact with glue covered surfaces of the studs tightly interlock with each other, as if you stuck one fluffy brush to another. Terminals on one surface are located on such distance from each other to perfectly match the rod with another surface. Once the indium and gallium in contact, they form a fluid that, in turn, reacts with the metal cores of the nanorods and solidifies quickly, turning into a solid monolith. The strength of this coupling is comparable with the results of welding or soldering.
Unlike other adhesive polymeric substances, MesoGlue after hardening remarkably conducts heat and electricity, the clutch cannot be loosened even strongly heated, the glue is highly resistant to moisture and air. Another advantage of this glue is that one does not need to exert much effort when gluing surfaces. Simply push the average power that the components tightly bonded together. The main application of such scientists see glue in electronics industry. On sale glue MesoGlue should appear soon under this name.
