Xiaomi company started sending out invitations to the press for the event, which will be held in China July 19, 2018. This day will be the announcement of the smartphone Mi 3 Max, the long-awaited rumored.
According to earlier leaks, the smartphone is enclosed metal case and has a frameless design without the cut-out screen in iPhone style X. He’ll get impressive to 6.99-inch display with an aspect ratio of 18:9 and resolution Full HD+ (2160 x 1080 pixels). It will also become the first representative of the series with dual camera. The main camera will receive the Sony sensor IMX363 on 12 MP as the main. The same sensor used in the flagship Xiaomi Mi 8 and Mi 2S MIX.
It is also noted on the front camera 8 MP, eight-core Snapdragon 636 with a clock frequency of 1.8 GHz, options RAM 3, 4 and 6 GB drives in 32, 64 and 128 GB, the battery is 5400 mAh, the Android operating system 8.1 Oreo. Dimensions are 176,15 x 87,4 x 7.99 mm and a weight of 221 grams.