Resource USwitch and Steve Hammerdorfer (Steve Hemmerstoffer), founder and editor of the resource NowhereElse.fr known organization leaks via the Twitter account @OnLeaks, has published a selection of renderings and realistic 3D model of the upcoming smartphone Samsung Galaxy S7 Plus, which has not yet been officially presented.
Judging from the images Samsung Galaxy S7 Plus is largely similar to the Samsung Galaxy S6, the sides of the screen seem to be rounded, it’s probably glass 2.5 D. Not much to present a slot for microSD, SIM-only, also there is no USB Type-C.
As previously reported, the Samsung Galaxy S7 Plus has impressive dimensions 163,32 x x 82,01 of 7.82 mm, which gives hope to the display diagonal of 6 inches.
Expected future flagship smartphone Samsung Galaxy S7 will be released in two versions — the Exynos-based 8890 and based on Qualcomm Snapdragon 820. Samsung, presumably, is experimenting with heat pipes of different types and shapes for the cooling of Samsung Galaxy S7. According to rumors, it is connected with possible problems with overheating of the chipset is Qualcomm Snapdragon 820. The announcement of Samsung Galaxy S7 can be held on February 21, the day before the opening of the exhibition MWC 2016 in Barcelona at the Samsung Unpacked event.